EP: Epoxy resin


Short Name
EP
Name
Epoxy resin
Group
TS - Thermosets
General Properties
Chemical Formula
Structural Formula

Properties

Glass Transition Temperature
50 to 200 °C
Melting Temperature
- °C
Melting Enthalpy
- J/g
Decomposition Temperature
380 to 450 °C
Young's Modulus
3000 to 5000 MPa
Coefficient of Linear Thermal Expansion
60 *10¯6/K
Specific Heat Capacity
1.67 to 2.10 J/(g*K)
Thermal Conductivity
0.17 to 0.52 W/(m*K)
Density
1.15 g/cm³
Morphology
Thermoset
General properties
Good toughness. Good adhesion on many substrates. Good chemical resistance. Low cure shrinkage
Processing
Compression, spreading, injection processes such as RIM, VARI, RTM
Applications
Building industry (e.g., corrosion protection, sealings, floor coating). Boat building (construction adhesive). Electronics industry (circuit boards). Matrix for fiber-reinforced composites

Internet Links

NETZSCH Measurements

Instrument
DSC 204 F1 Phoenix®
Sample Mass
13.22 mg
Isothermal Phase
5 min
Heating/Colling Rates
10 K/min
Crucible
Al, pierced
Atmosphere
N2 (40 ml/min)

Evaluation

As an amorphous polymer, this epoxy resin exhibits a glass transition at 77°C (midpoint) with a specific heat capacity of 0.14 J/(g.K) in the 1st heating (blue) followed by an exothermal effect (peak temperature 174°C), due to post-curing of the resin. As a result of the post-curing, the glass transition temperature in the 2nd heating (green) is shifted to 88°C (midpoint).
The step height remains nearly the same. Since no further exothermal effect occurs, it can be assumed that the epoxy resin was entirely cured during the 1st heating.
Both the exothermal effect and the position (and shift) of the glass transition temperature to higher values can be interpreted as an evidence for the degree of curing of the material.

Back to List